Thermal Live Spring Summit 2024

Demo | Thermasolv™ Fluorinated Fluids vs. Hydrocarbons for Immersion Cooling | Inventec

The rapid advancements in supercomputing have sparked significant growth in energy consumption within data centers. This surge has resulted in a rise in heat generation, presenting a new challenge for the industry to address. Immersion cooling has the potential of reaching 1.01 PUE, prompting companies to seek out the most effective and sustainable cooling fluid for their data centers. The primary objective of this presentation is to conduct a comparative analysis between Inventec’s Thermasolv range and hydrocarbon fluids for immersion cooling. This analysis will focus on evaluating the performance, compatibility, and safety of each cooling fluid option.

Webinar | Sustainability Impact of Thermal Encapsulants (Part 1) | RECOM Power

Steve Roberts, Innovation Manager, RECOM Power & Patricio Cantu Sanchez, Project Manager, RECOM Power

There are many good reasons why electronic assemblies such as power supplies are fully encapsulated.

Encapsulation (or potting) seals the components against dirt and moisture, provides mechanical strength and also lowers the thermal impedance, conducting heat away from hot core components to the case and environment. However, a fully potted electronic assembly is difficult to repair or recycle, conflicting with modern sustainability targets.

This webinar will explore the environmental impacts of using encapsulants in production and suggest some ways to reduce the energy consumption and carbon footprint.

RECOM Power will be back at Thermal Live Fall Summit 2024 to present Part 2 of this insightful webinar.

Webinar | A Deep Dive into PFAS Chemicals: Will PFAS be the Death of Two-Phase Cooling? | Inventec

Jonathan Tomassetti, Technical Sales Executive, Inventec

As two-phase dialectic fluids transition from liquid to vapor, they efficiently dissipate heat, with PUEs as low as 1.01, making them a superior choice for data center cooling processes. However, due to the reliance of two-phase cooling on PFAS forever chemicals, suppliers of alternative cooling processes have raised concerns about its sustainability. This presentation dives deep into the science and legislation surrounding PFAS to determine whether two-phase cooling is a regrettable substitution or a viable solution for reducing energy consumption and combating global warming.

Demo | Fujipoly’s New Battery Safety Materials: Preventing Fire and Heat Propagation | Fujipoly

Christian Miraglia, Applications Engineering Manager, Fujipoly America – Customer Engineering Resource Center (CERC)

As batteries power more electric vehicles and energy storage systems, safety is paramount. Fujipoly America addresses this critical need with its latest materials for battery manufacturers and integrators.

In this product demonstration we will introduce G1S20488 Anti-Thermal Propagation Material: This innovative material stops heat from spreading between battery cells and addresses internal changes within the cells to prevent malfunctions. We will also introduce G1S20360 Anti-Fire Propagation Material: This material helps engineers significantly reduce the risk of battery fires from starting and spreading, containing them for better safety.

Webinar | High-Reliability Liquid Cooling Solutions | Boyd

Michael St. Jean, Applications Engineer, Boyd Corp & Ryan McCarthy, Business Development Director, Data Center Cooling Solutions, Boyd

As the use of liquid cooling systems becomes more prevalent, it is imperative to develop dependable solutions that enhance device performance under critical operating conditions and ensure leak-free operation throughout the product lifespan.

This webinar will offer a thorough examination of essential components within liquid cooling systems and emphasizes strategies to optimize reliability. Successful liquid cooling necessitates meticulous planning, thorough characterization, and rigorous testing. The insights presented in this webinar are applicable across various industries, such as Medical, eMobility, Data Center, Industrial, and Semiconductor, with practical solutions and case studies discussed.

Webinar | Flow & Form Factor: Performance and Features to Understand When Designing Liquid Cooling | CPC

Chris Winslow, Lead Technology Writer, Colder Products Company

As designers embrace the fact that liquid cooling is better at transferring heat at much lower mass flow rates compared to air cooling, attention to thermodynamics in combination with flow rate is critical. So, with the assumption that thermal engineers have already accounted for material and fluid chemical compatibility in their liquid cooling designs, flow (Cv or KV) is the next most important aspect to tackle. The impact of individual components on flow rate is often misunderstood or undervalued.

Using quick disconnects (QDs) as the system component product of reference, Chris will describe how exterior product dimensions are not an indicator of flow path size and how individual product design (latched, ball-and-sleeve, blind mate) impacts flow capacity. This presentation will address individual component features such as valve structures that affect flow rates and pressures, and why understanding the variability between sizes, styles, and manufacturers matters. Discussion will include system pressure, air inclusion, quick disconnect (QD) valve design, and termination information.

Attendees will leave with an understanding of how to calculate the total pressure drop in the liquid line (via expansions, contractions, bends, valves) and why system subcomponent sizing matters in fulfilling hydrodynamic requirements to address thermal requirements and what to look for in designing an optimized system.

Webinar | Thermoelectrics for High Heat Flux Applications | Sheetak

Brandon Noska, Director of Application Engineering, Sheetak & Uttam Ghoshal, Founding CEO & CTO, Sheetak

Thermoelectric cooling modules are used in a variety of applications such as optoelectronics, medical diagnostics (PCR), and general electronics cooling. There are many design parameters that affect the overall performance of the thermoelectric cooling module such as the thermoelement geometry, number of thermoelectric junctions (couples), substrate materials and system components including the external heat rejection and absorption heat sinks. There are many applications such as high-power processors (CPUs/GPUs), power electronics, and air conditioning that have higher heat flux and need to be considered in the thermoelectric device and system design. In this presentation, we will explore general thermoelectric operation and design parameters, applications that require high heat flux but low to moderate temperature differentials, and compare design and performance considerations for traditional thermoelectric devices to thin film thermoelectric technology.

Demo | How to Select Boyd’s Standard Liquid Cooling Products | Boyd

Michael St. Jean, Applications Engineer, Boyd Corp

Boyd provides a range of standard liquid cooling solutions including cold plates, heat exchangers, cooling distribution units (CDU), and chillers. Our extensive distribution network enables swift product availability, expediting product development and deployment processes. We offer detailed cooling curves to assist in selecting the most suitable product for specific applications.

In this product demonstration, we will use a case study to showcase the simplicity of selecting a standard heat exchanger from Boyd’s offerings. Additionally, we will explore when it may be more appropriate to opt for a custom design over a standard one, addressing relevant considerations for decision-making.