THE WORLD’S LARGEST,
ONLINE THERMAL MANAGEMENT EVENT

October 20-21, 2020

The Thermal LIVE Experience

Thermal LIVE is a free, 2-day online event for electronics and mechanical engineers in the thermal management space. Join hundreds of other thermal management professionals to learn the latest innovations and techniques directly from industry thought leaders. Network with peers while you take in technical presentations, product demonstrations, and interact with expert speakers in real-time.

Can’t attend live? Don’t sweat it. After the event, all presentations will be made available on demand for you to view on your schedule. Again – there’s no cost for attendees.

Ready to experience Thermal LIVE for yourself? Registration is open!

TECHNICAL PROGRAM
Dereje Agonafer

DEREJE AGONAFER, Ph.D., NAE

Presidential Distinguished Professor in MAE, University of Texas at Arlington (UTA)
Presentation Sponsored By Cofan USA

Tuesday, October 20, 2020 | 9:00 am ET

KEYNOTE – Single Phase Immersion Cooling of Data Centers: Opportunities and Challenges

Data center cooling has never been more challenging as it is today with the thermal design power (TDP) of the components rising by almost 50% in the past decade. With advancements in 2.5D and 3D packaging architectures for realizing smaller feature sizes in this decade, an increase in local power densities has necessitated the requirement of more efficient cooling technologies for… Continue Reading

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Tim Jensen

TIM JENSEN

Sr. Product Manager for Engineered Solder Materials
Indium Corporation

Tuesday, October 20, 2020 | 10:00 am ET

Novel TIMs to Enable Advanced Thermal System Design for High Performance and Quantum Computing Applications

Thermal system design is a critical aspect in both high-performance and quantum computing applications. Part of that system is the thermal interface material (TIM). This presentation will… Continue Reading

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Kimberly Fikse

KIMBERLY FIKSE

Lead Sales Engineer
Advanced Cooling Technologies, Inc.

Tuesday, October 20, 2020 | 11:00 am ET

Advanced Thermal Techniques Across Diverse Industries

In this webinar, we will share real-world examples where creative approaches in thermal engineering have allowed design engineers to push their design concepts forward. Join us as we explore some… Continue Reading

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Christian Mainegra

CHRISTIAN MAINEGRA

Applications Engineer
Fujipoly

Tuesday, October 20, 2020 | 12:00 pm ET

Advantages of Putty Type: Thermal Interface Gap Filler Materials

Fujipoly will reveal many of the advantages of putty type thermal interface materials offer compared to standard gap filler pads. Key topics will include stress-strain comparisons of putties… Continue Reading

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CT Kao

CT KAO

Product Management Director in the MSA group
Cadence Design Systems, Inc.

Tuesday, October 20, 2020 | 1:00 pm ET

PRODUCT DEMO – Celsius Thermal Solver: The Thermal Solution for Intelligent System Design

As power densities on IC designs continue to increase, controlling temperature on the chip is becoming a major challenge for IC designers. High temperature impacts both the reliability and… Continue Reading

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Jonathan Taylor

JONATHAN TAYLOR

Product Manager
NeoGraf Solutions, LLC

Tuesday, October 20, 2020 | 1:45 pm ET

NeoNxGen™ Thermal Management Solutions – Increase the Thermal Performance, Not the Layers!

The latest generations of high-performance consumer electronics need thermal spreaders that are both very thin and highly… Continue Reading

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Michael Gonzalez

MICHAEL GONZALEZ

Sales Engineer, CDCP
CEJN North America

Tuesday, October 20, 2020 | 2:45 pm ET

Blind-Mate Couplings: Design and Manufacturing Aspects

This session will focus on the increasing liquid cooling demand with required quality, tolerances, and technical design considerations of a blind-mate coupling, which is needed… Continue Reading

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Anand Samant

ANAND SAMANT

Global Market Director for Consumer Electronics
Materion

Tuesday, October 20, 2020 | 3:45 pm ET

Advanced Materials Strategies for Cooling Modules in Electronic Systems

Higher data-transfer rates and power-usage requirements result in increasing heat-management challenges for thermal engineers in the electronics… Continue Reading

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Brad Whitney

BRAD WHITNEY

Product Director/ VP of Two Phased Cooling
Boyd Corporation

Wednesday, October 21, 2020 | 10:00 am ET

Utilizing Ultra-Thin Two Phase Cooling & Ultra-Thin Titanium Vapor Chambers to Improve Performance

Ultra-thin two-phase technologies such as Vapor Chambers, Titanium Vapor Chambers, and Heat Pipes can be a cost-efficient way to vastly improve the performance… Continue Reading

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Andres Abraham

ANDRES ABRAHAM

Applications Engineer, Thermal Business Unit
CPC (Colder Products Company)

Wednesday, October 21, 2020 | 11:00 am ET

Liquid Cooling: Getting in the Know About Flow

To optimize performance and enhance sustainability, engineers need to consider how managing fluid flow for cooling within an advanced electronics application differs from traditional air-flow cooling systems. Understanding the heat transfer… Continue Reading

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Keith Perrin

KEITH PERRIN

Global Director for Electronics
Hexagon Manufacturing

Wednesday, October 21, 2020 | 12:00 pm ET

Advanced Micro-Structural & Thermal Modeling for Energy Generating, Wearable, Electronics

At Hexagon we’re dedicated to bringing the virtual and physical worlds together to enable our customers to drive their ideas forward and stay ahead. Nowhere is this more important… Continue Reading

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Nicolas Monnier

NICOLAS MONNIER

Product & Market Specialist
Stäubli North America

Wednesday, October 21, 2020 | 1:00 pm ET

PRODUCT DEMO – Quick Connectors for Two-Phase Fluids

Following the adoption of liquid cooling, two-phase fluids are a growing interest in the engineering community due to many thermal advantages. As a leader in the IT Cooling industry, Stäubli will present the main technical considerations for using quick disconnects… Continue Reading

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Metodi Zlatinov & Denver Schaffarzick

METODI ZLATINOV | DENVER SCHAFFARZICK

Technical Lead, R&D | Director of Engineering
ERG Aerospace

Wednesday, October 21, 2020 | 1:45 pm ET

Metal Foams Make Better Heat Exchangers

When faced with high heat fluxes and challenging packaging constraints, it is time to look beyond conventional fins and consider high-performance metal foam heat sinks, cold plates, and heat exchangers. Due to their high surface area, turbulence-enhancing pore structure … Continue Reading

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Joseph Forbes Petri

JOSEPH FORBES PETRI

Electronic Assembly Solutions Account Manager
3M

Wednesday, October 21, 2020 | 2:45 pm ET

Thermal Management for a Connected World

In the world of IoT, and an increasing number of connected devices, electronic devices and components are expected to provide greater functionality to meet higher performance.… Continue Reading

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John Wilson

JOHN WILSON

Electronics Product Specialist
Siemens Digital Industries Software

Wednesday, October 21, 2020 | 3:45 pm ET

Thermal Analysis, Electronics Reliability and the Influences of Variability

The traditional use of electronics thermal analysis in its basic function has always been to assess whether a design will meet requirements representing.… Continue Reading

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THERMAL LIVE 2020 SPONSORS

Advanced Cooling Technologies
Boyd Corporation
Cadence 
CEJN
Cofan USA
CPC - Colder Products Company 
ERG Materials & Aerospace
Fujipoly
Indium Corporation
Materion
Siemens - Ingenuity for Life 
Hexagon_MSC Software_Cradle CFD
Neograf
STÄUBLI International
3M
TTI

THERMAL LIVE UPDATES

Want to be the first to know about any changes or additions to the program?

Curious how last year’s show went?

In 2019, Thermal LIVE welcomed over 3,800 registrations from 112 countries, and every continent save for Antarctica. Registrants represented approx. 650 companies across a full spectrum of industries. We expect 2020 to be an even greater success.

You can view the full 2019 program on demand here.

MEDIA SPONSORS

Electronics Cooling
Interference Technology