THE WORLD’S LARGEST,
ONLINE THERMAL MANAGEMENT EVENT
OCTOBER 22 – 23, 2019 | ONLINE
THERMAL LIVE UPDATES
Thermal LIVE is a free, 2-day online event for electronics and mechanical engineers in the thermal management space. Join thousands of other thermal management professionals to learn the latest innovations and techniques directly from industry thought leaders. Network with peers while you take in technical presentations, roundtables, product demonstrations, and interact with expert speakers in real time.
In 2018, Thermal LIVE welcomed over 4,100 registrations from 47 countries, and every continent save for Antarctica! We expect 2019 to be an even greater success.
Can’t attend live? Don’t sweat it. After the event, all presentations will be made available on demand for you to view on your schedule. Again – there’s no cost for attendees.
Ready to experience the Thermal LIVE heat for yourself?
BRUCE GUENIN, Ph.D.
Associate Technical Editor
October 22, 2019 | 9:00 am ET
KEYNOTE: Whatever Happened to the Predicted Data Center Energy Consumption Apocalypse?
In the early years of the internet between 2000 and 2008, the total energy consumed by data centers in the US increased by 15% per year, representing a doubling of energy consumption in six years and a tripling in nine years. This created a sense… Continue Reading
Senior Product Manager for Engineered Solder Materials
October 22, 2019 | 10:15 am ET
Liquid Metal Thermal Interface Material Innovations for High-Performance Devices
The idea of using liquid metals as a thermal interface material (TIM) is not new. Liquid metal provides very high thermal conductivity, as well as low interfacial resistance when in contact with most surfaces; however,… Continue Reading
Product & Market Specialist
Stäubli North America
October 22, 2019 | 11:15 am ET | PRODUCT DEMO
Design Consideration for the Mechanical Integration of Quick Disconnects in Liquid Cooled Electronic Systems
Liquid cooling for heat dissipation in electronic systems is becoming a requirement as the power of components is increasing, as well as density. The use of performant quick disconnects allowing the hot swap of the active components from the static structure… Continue Reading
Principal Application Engineer, Technical Customer Service
October 22, 2019 | 12:00 pm ET
Raising Reliability of Devices for 5G Telecom Infrastructure
The coming era of 5G mobile communications has users excited about the possibilities and broadband systems designers and manufacturers a bit nervous about the realities. While handheld devices may have the required… Continue Reading
Applications Engineering Manager
October 22, 2019 | 1:15 pm ET
Understanding Thermal Gap Filler Pads, PCB Deflection and Stress
Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar we will look at the compression characteristics of thermal gap filler pads. We will apply… Continue Reading
SUKHVINDER S. KANG
Aavid, Thermal Division of Boyd Corporation
October 22, 2019 | 3:00 pm ET
Thin Vapor Chambers for Highly Effective Passive Two-phase Heat Spreading in Thin Devices
In the last two decades, two-phase devices such as heat pipes and vapor chambers have greatly enhanced efficient, cost effective, passive heat spreading in a broad range of commercial and industrial products. Meanwhile, the thinnest consumer devices … Continue Reading
Electronics Product Specialist
Mentor Graphics, A Siemens Business
October 22, 2019 | 4:15 pm ET
Accelerating Thermal Design with Boundary Condition Independent Reduced-Order Models
Understanding the time-varying temperature response is critical for designing many of today’s electronic products. Predicting temperature response through full 3D simulation of detailed components is often too prohibitively time-consuming limiting the… Continue Reading
Product Manager, Thermal Management
CPC (Colder Products Company)
October 23, 2019 | 12:00 pm ET
The Future is Now: Advanced Connector Solutions for Liquid Cooling
Robust liquid cooling is becoming a requirement given the heat generated by increased power densities across a variety of applications—high-performance computing, data centers, electric vehicle (EV) charging… Continue Reading
Advanced Cooling Technologies, Inc.
October 23, 2019 | 1:15 pm ET
Passive and Active Two-Phase Cooling for Power Electronics
Advanced Cooling Technologies will review strategies for managing the rising waste heats from MOSFETs, IGBTs and other power electronics modules using two-phase technology. This session will focus on… Continue Reading
Product Management Director
Cadence Design Systems, Inc.
October 23, 2019 | 2:15 pm ET | PRODUCT DEMO
Overcoming Design Challenges with Electrical-Thermal Co-Simulation
Electrical-thermal co-simulation plays a critical role in system design. Not only are electrical and thermal behaviors convolving in nature, but also their widespread length and time scales in real applications demand efficient and accurate … Continue Reading
Director of Product Management
October 23, 2019 | 3:00 pm ET
Advancements in Solid-State Cooling Technologies
This presentation will cover market trends driving the need for increased efficiency and miniaturization of solid-state cooling technologies. We will show different device architectures to achieve higher temperature differentials with .… Continue Reading
October 23, 2019 | 4:15 pm ET
Next-Generation Electronics Packaging Design with Cloud Engineering Simulation
Rapid advancements in the internet and the cloud technologies have led to new applications, the most notable being the new frontiers of artificial intelligence with machine learning and deep learning algorithms. Such modern.… Continue Reading
INTERESTED IN PRESENTING AT
THERMAL LIVE 2019?
Are you a thermal management expert?
Want to establish yourself as a thought leader in the field,
or maybe you have a new thermal management product or technique you’re eager to share with your industry peers?
Participating in Thermal LIVE 2019 as a presenter is a perfect opportunity for you.
We’d love to speak with you about it!