THE WORLD’S LARGEST,
ONLINE THERMAL MANAGEMENT EVENT
October 19-21, 2021!
The Thermal LIVE Experience
Thermal LIVE is a free, 3-day online event for electronics and mechanical engineers in the thermal management space to learn about the latest innovations, trends, and challenges directly from industry thought leaders.
Past topics have included advanced thermal techniques in power electronics, design and manufacturing of blind mate couplings, selecting TIMs for different applications, calculations and design elements for liquid cooling, and more.
Join us for our 7th year! Registration is open now!
DR. BAHGAT SAMMAKIA
Vice President for Research Distinguished professor of mechanical engineering
Binghamton University
Presentation Sponsored By Future Facilities
October 19th at 10:00 AM EDT
Heterogeneous Integration for Electronics Packaging; an Overview of a Newly Founded Industry-University Research Center Focused on Power Delivery, Thermal Management, Fine-pitch Interconnects, and System Optimization
Heterogeneous Integration refers to the integration of separately manufactured components into a higher level assembly (SiP) that, in the aggregate, provides enhanced functionality and improved operating characteristics. In this definition… Continue Reading
REGISTER NOW
CHRIS CHAPMAN
Product Director / VP Liquid Systems Boyd Corporation
Boyd Corporation
October 19th at 11:00 AM EDT
End to End Liquid Cooling Solutions and Systems for Enterprise, Cloud Compute, 5G, and Power
This will cover the components, integrated systems, and new technologies for Enterprise, Cloud Compute, 5G and High Power Electronics (large systems) as well as the considerations when moving from Air to Liquid Cooling. Continue Reading
REGISTER NOW
Miloš Lazić
Product Development Specialist
Indium Corporation
October 19th at 12:00 PM EDT
An All Metal Based Solid/Liquid Hybrid Thermal Interface Material Solution for Ultra High-Power Density Computing Applications
Thermal system design is a critical aspect in ultra-high density components. Traditional thermal interface materials (TIMs) are challenged to meet the thermal demands of these components and the systems they are integrated into. A unique patented solid/liquid hybrid process and material solution that combines liquid metal with a metal preform is developed to provide very reliable… Continue Reading
REGISTER NOW
KIRA SWITALLA | CHRISTOPHER WINSLOW
Engineers, Thermal Business Unit CPC
CPC Worldwide
October 19th at 1:00 PM EDT
Specifying QDs with Confidence: Opportunities & Pitfalls When Selecting Connectors for Liquid Cooling Applications
All liquid cooling coupling manufacturers offer a variety of quick disconnects (QDs) AND there are multiple suppliers around the globe. How is a team designing a liquid cooling solution for a specific application to know which quick release connector is right for them? Continue Reading
REGISTER NOW
JOHN BIDDLE
Vice President Product Development Polymer Science, Inc
Polymer Science, Inc.
October 19th at 2:00 PM EDT
PRODUCT DEMO: Evolution in Thermal Management Solutions to Address the Challenges in Battery Design
As we continue navigating a global pandemic while also facing increasing environmental challenges like wildfires and extreme climate changes, concerns over air quality have been mounting. Continue Reading
REGISTER NOW
GEORGE RIKER | VINEET BAROT
Business Development Manager, ebm-papst | Technical Support Manager, Sager Electronics
ebm-papst – Sager Electronics
October 19th at 2:45 PM EDT
Improving Indoor Air Quality
As we continue navigating a global pandemic while also facing increasing environmental challenges like wildfires and extreme climate changes, concerns over air quality have been mounting. Continue Reading
REGISTER NOW
JOHN GRISDALE | GREGG SZYLAKOWSKI
Chief Growth Officer Sur-Seal® Company | Technical Business Development Manager Sur-Seal® Company
Sur-Seal
October 19th at 3:45 PM EDT
Thermals, Made Easy
Does choosing the right thermal interface material seem overly complicated or like guesswork? We think so too. That’s why the Sur-Seal® Company wanted to take the chance to simplify the science behind how thermal interface materials work… Continue Reading
REGISTER NOW
MICHAEL GONZALEZ
Sales Engineer, CDCP
CEJN Industrial Corporation
October 20th at 10:00 AM EDT
Not All Quick Connect Couplings are Created Equal: Large Diameter Quick Connects Demands
Quick connect couplings are often required as the technical solution in high density applications with modular liquid cooling across various industries. Some of these projects require a large diameter coupling which, in turn, create a new set of technical demands. Continue Reading
REGISTER NOW
JOEY SCIMECA
Materials Engineer
Thermexit
Nanoramic Laboratories
October 20th at 11:00 AM EDT
Maximizing Thermal Interface Material Performance in High-Reliability Applications
In this talk, we’ll discuss the thermal management problems faced by high-reliability electronics systems designers. High-performance thermal interface materials (“TIMs”) are typically silicone-based. In thermal and vacuum environments, silicone-based materials have the tendency to outgas and break down. This behavior induces thermal performance degradation within.… Continue Reading
REGISTER NOW
MALKIAT SINGH
Director of Liquid Systems
Boyd Corporation
October 20th at 12:00 PM EDT
10U Liquid to Air Coolant Distribution Unit (CDU) (DEMO)
This product demonstration will cover 10U Liquid to Air Coolant Distribution Unit (CDU) solution. Continue Reading
REGISTER NOW
ANUP PAUL
Business Development Director, CFD
Hexagon | MSC Software
October 20th at 12:45 PM EDT
Optimizing Thermal Management in Medical Electronics with Digital Twins
Hexagon’s heritage and expertise is in manufacturing data, with digital touchpoints that converge the physical and digital worlds throughout the entire process: from concept to customer. In this session, we explore how leveraging digital data and advanced analytics can… Continue Reading
REGISTER NOW
RAYMOND HUNG
Sales Manager
Schlegel Electronic Materials
October 20th at 1:45 PM EDT
Selection of Thermal Interface Material (DEMO)
In this webinar, we will introduce various types of thermal interface materials, the pros and cons of different types of TIMs and the factors to consider when selecting the TIM. Webinar attendees will have a better understanding and basic knowledge of TIM and its application. Continue Reading
REGISTER NOW
DR. MELIKA ROSHANDELL
Product Marketing Director for Celsius Thermal Solver Software
Cadence Design Systems, Inc (software) – California
October 20th at 2:30 PM EDT
Cut PCB Development Times with Thermally Aware Design and Optimization
This presentation showcases the innovative capabilities within the Cadence® Celsius™ Thermal Solver for package and PCB designers. The Celsius Thermal Solver enables thermal aware performance optimization in early stages of design. The unique electro thermal co-simulation ability not only reduces design cycles, but also highlights potential reliability and performance thermal risks in package and PCB designs. Continue Reading
REGISTER NOW
BLAKE WAGEMAN
Thermal Applications Engineer
Henkel Corporation
October 20th at 3:30 PM EDT
Advanced Thermal Gel Solutions for Data & Telecom Systems
Learn more about the tough conditions associated with data and telecom applications and why stable, conforming thermal interface materials are a necessity for optimal function. The webinar will present details about the distinctive performance characteristics of thermal gels and how they compare to alternative approaches. Continue Reading
REGISTER NOW
PAUL DIXON
Staff Scientist
Laird Performance Materials
October 21st at 10:00 AM EDT
Thermal and EMI Mitigation in Telecom and 5G: Dense Design Challenges
Laird Staff Scientist Paul Dixon explores myriad challenges facing design engineers seeking to resolve what is sometimes simultaneous heat and EMI issues affecting device performance. Continue Reading
REGISTER NOW
KIMBERLY MANKOSA
Lead Sales Engineer
Advanced Cooling Technologies (ACT)
October 21st at 11:00 AM EDT
Passive Thermal Control for High Power Components
Join us as we dive into solving one of the most demanding and continuously evolving challenges in the electronics cooling industry- managing high heat flux and high total power. As power electronics and other devices continue to evolve, they are producing more and… Continue Reading
REGISTER NOW
JAMES STRATFORD
CEO
Universal Science, Inc.
October 21st at 12:00 PM EDT
Revolutionise The Way You Purchase Pads & Gaskets! (DEMO)
Never before has it been possible to order complex shaped custom pads and gaskets online from an instant quote with no tooling charges, no minimum order quantities despatched within 24 hours. Continue Reading
REGISTER NOW
CHRISTIAN MIRAGLIA
Applications Engineering Manager
Fujipoly America Corp.
October 21st at 12:45 PM EDT
Dispensable Thermal Interface Materials: An Overview
This webinar will provide an overview of Dispensable gap fillers and what advantages they can provide over other gap filler products. We will discuss packaging and dispensing options, and factors that impact flow rates. Continue Reading
REGISTER NOW
GO IGARASHI
Sales Representative
A.L.M.T Corp
October 21st at 1:45 PM EDT
PRODUCT DEMO: New composites material of Silver and Diamond for high-performance device
Packaging material for a high-performance device like GaN and SiC requires not only high Thermal Conductivity (TC) but also a Co-efficient Thermal Expansion (CTE) close to that of the semiconductor chip and other packaging materials. Continue Reading
REGISTER NOW
JOHN WILSON
Siemens Digital Industries Software
Siemens Digital Industries
October 21st at 2:30 PM EDT
PCB Electrothermal Modeling Accuracy and Thermo-Mechanical Analysis Workflow
In multi-layer complex boards and with increasing power density, there are thermal design accuracy benefits in modeling board copper trace power dissipation accounting for electrical resistance changes with temperature. The first part of the presentation focuses on a new co-simulation method combining 3D electronics cooling analysis with a board-level power integrity EDA simulation software used for DC drop analysis.… Continue Reading
REGISTER NOW
JOE DORSEY
Engineer
future faclities
October 21st at 3:30 PM EDT
Modernizing Electronics Thermal Simulation
The use of simulation for electronics cooling has been a mainstream practice since the mid-1990s. Since then, advancements in compute capacity, user experience and a shift to cloud solutions have revolutionized the industry. Unfortunately, most tools in this space have the same look, feel, and performance that they did 25 years ago. Continue Reading
REGISTER NOW
MASTER SPONSOR
THERMAL LIVE UPDATES
INTERESTED IN PRESENTING AT
THERMAL LIVE?
Participating in Thermal LIVE as a presenter is a perfect opportunity for you.
As a presenting company, you have a platform to share your expertise in the form of a webinar or video with an audience of hundreds of thermal management engineers, promote your products or industry innovations, and generate sales-qualified leads.
Thermal LIVE 2020 in the Books
In 2020, Thermal LIVE welcomed over 2,000 registrants from 67 countries, and every continent save for Antarctica. Registrants represented approx. 1,390 companies across a full spectrum of industries.
MEDIA SPONSORS
