Below are the questions asked during the event, along with their respective answers.

Q: Are you able to deal with thermo-structural cycling and fatigue?
A: Yes. We have a number of detailed modular solutions for thermal, structural, and fatigue, which can be brought together to solve fatigue issues arising from thermal cycling. These are actually available as a service subscription, saving significant money.

Q: What are the limits of simulation?
A: At the end of the day, simulation is only as good as the assumptions an engineer puts into them. Therefore simulation and test are natural bed-fellows typically requiring results to be aligned and used together. For example, it’s typically a company would undertake design simulation to guide design direction in the early stages of development. They then might choose to align their simulated results to initial physical test results, correlating them together. This involves tweaking the simulation models to match their physical results. This then allows them to continue iterating in the virtual world.

Q: What sort of fidelity can you scan to, and for what applications?
A: It depends on the specific application, but Hexagon has a range of scanning technology that can scale from 4um, up to entire cities. Obviously for electronics, this means we’re looking at detailed physical electronic component design elements up, internally or externally, with lasers, optical scanners, CT scanners, and X-ray. A simple example could be the alignment of the pins on a chip, and their alignment on a PCB board.