Novel Thermally Conductive Low Pressure Over-Mold Materials as a Solution for Thermal Management
Webinar
Overview:
By replacing the TIM, heat sink and protective housing by a single thermally conductive, protective thermoplastic over-mould material, system performance can be maintained and the assembly process streamlined. In the following paper the processing and performance of such materials will be discussed. The isotropic nature of these materials allows heat dissipation not just in the vertical direction as with a traditional system, but also laterally, thus reducing hot spots and enhancing overall performance. Thermal models show that even a modest thermal conductivity (0.5W(mK)-1) can reduce hot spots by over 30ºC compared to a regular low pressure moulding material. These materials retain the low melt viscosities typical of LPM materials and can easily be moulded in to a wide variety of shapes allowing flexibility in the final form of the product.
Who Should Attend: All electronics and mechanical engineers plus thermal management professionals who are looking to improve their practical knowledge in thermal management.
Speaker: Art Ackerman
Art Ackerman currently serves as a Global Product Manager for Circuit Board Protection materials for Henkel Electronic Materials, where he supports a global customer base and a broad range of advanced materials products. Much of his work centers on development of electronic assembly processes in automotive, industrial component, and LED and lighting markets.
Upon completion of his degree in Chemical Engineering at the University of California at Santa Barbara, Ackerman spent 5 years working in the semiconductor industry with a focus on novel processing techniques in front end semiconductor applications. Since joining Henkel, Ackerman has held various positions including Applications Engineering where he gained expertise in materials for RF transceiver design, Solar and Photo voltaic manufacturing, and electronic protection for harsh environments. This work has proved an invaluable foundation for Ackerman’s current efforts with materials such as high reliability potting materials, low pressure moldable encapsulants, and chemical and temperature resistant materials, to enable next-generation assembly processes.