Aavid has been successfully delivering engineering excellence since its inception in 1964 when it was founded as Aavid Engineering. For over 50 years, Aavid has been the world leader in thermal management solutions and the partner of choice for electronics companies focused on introducing next generation products to market faster, with greater reliability, and increased functionality.
If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge, or put on wearable technology, chances are you’ve used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. We help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and engineer products limited only by imagination.
Autodesk makes software for people who make things. If you’ve ever driven a high-performance car, admired a towering skyscraper, used a smartphone, or watched a great film, chances are you’ve experienced what millions of Autodesk customers are doing with our software.
Celsia designs and manufactures heatsinks using liquid two phase cooling devices. The company’s executives were among the innovators in mass produced, cost approachable heat pipes and vapor chambers. Through our US headquarters and Taiwan design & production facility, Celsia’s goal is to deliver fast, affordable, and reliable thermal solutions for the most demanding applications. We specialize in custom heat sink assemblies using two phase devices for the telecommunication, networking, computer, medical, defense, and auto industries, among others.
We set Future Facilities up to deliver the power of engineering simulation into the hands of an emerging data center industry. We created a tool optimised for data centers, designed to be used by the DC professional, and made it powerful, intelligent, automated and connected.
Five years later, we tuned our technology to deliver the same benefits to the thermal management of electronics and provide an integrated toolset for these two converging industries. In 2015 we were awarded Product of the Year at the Engineering Simulation Show.
Innovation, performance and customer satisfaction are Henkel’s guiding principles. Today, Henkel supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates.
Mentor Graphics® is a leader in electronic design automation software. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products and solutions help engineers conquer design challenges in the increasingly complex worlds of board and chip design.
Thermal problems can come from anywhere. Thermal solutions come from Phononic.
Whether your challenges are antiquated compressors, massive heat sinks, or noisy, unreliable fans, Phononic can help. Phononic’s solid state cooling and heating technology enables us to provide component, module, and system-level solutions never thought possible.
We’ve brought together the brightest minds in touch sensing to solve the biggest problems users complain about when using touch-enabled devices in the rain, with gloves, with sweaty fingers, when dirty, and in extreme temperatures.
We are seasoned techies and business leaders, from our founders to our team. We invented the last generation of touch technologies that power our smart devices and are being used in 100s of millions of devices today.
The thermal solutions Wakefield-Vette manufactures comprise a wide array of products, including thermal extrusions, LED heat sinks, heat frames and pipes, fans, heat exchangers, coolant distribution units, liquid cold plates, etc., making Wakefield-Vette unique in its ability to deliver the increasingly complex thermal solutions required to meet the thermal engineering challenges of today’s ever-higher electronics packaging densities.